- 产品详情
- 产品参数
产品结构：硅台面型塑料封装。
特 点：◆体积小、重量轻，单只重量约 0.6 克。
◆芯片与引出端为熔焊键合。
◆瞬时过载能力强。
质量等级及执行标准：
◆国标Ⅱ类“J”
GB4936.1-85 Q/FR101-91
主要用途： 在电子线路中作过压保护用。
最大额定值
参数名称 | 符号 | 最大额定值 | 单位 |
总耗散功率a | Ptot | 1 | W |
峰值脉冲功率 | Ppp | 1500 | W |
工作温度 | Top | -40～125 | ℃ |
贮存温度 | Tstg | -40～125 | ℃ |
a 当TA＞25℃时按 10mW/℃线性降额。 | |||
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